Quotes within one business dayISO 9001 · IPC-6018 Class 3

RF and microwave PCB manufacturer

RF and microwave PCBs, built to the stackup you simulated

Rogers, Taconic, Isola and PTFE laminates from prototype to production. Every quote is reviewed by an RF engineer and comes back with a DFM report.

Laminates rated to
81 GHz
RF etch tolerance
±0.02 mm
Hybrid PTFE / FR-4
16 layers
Quote with DFM report
24 h

Insertion loss, 50 Ω microstrip

28GHz

Per 100 mm on a 0.508 mm core, 1 oz copper, datasheet Df and foil roughness. Hatched: above the laminate's rated range.

Size your own line in the impedance calculator

Laminates in stock from

Laminate database

Design Dk, loss and rated frequency for the laminates engineers ask us for most. Every row opens a full datasheet with fabrication notes.

Open all 14 laminates
Laminate Dk design Df Loss @ 28 GHz Rated to Cost
High-Tg FR-4 FR-4 4.30 0.0170 8.64 dB* 6 GHz
RO4350B Rogers 3.66 0.0037 2.82 dB 30 GHz
RO4003C Rogers 3.55 0.0027 2.39 dB 30 GHz
Astra MT77 Isola 3.00 0.0017 1.65 dB 81 GHz
RO3003 Rogers 3.00 0.0010 1.33 dB 81 GHz
RT/duroid 5880 Rogers 2.20 0.0009 1.07 dB 81 GHz

Loss per 100 mm of 50 Ω microstrip on a 0.508 mm core with 1 oz copper, including foil roughness. * above the laminate's rated range.

Manufacturing capability

Built for RF tolerances, not adapted from a digital line.

About the factory
Layer count1 to 24 layers, hybrid up to 16
RF laminatesRogers, AGC (Taconic), Isola, Panasonic, Wangling
Minimum trace and space0.075 mm / 0.075 mm (3 / 3 mil)
RF etch tolerance±0.02 mm on controlled layers
Impedance tolerance±5% with TDR coupons, ±10% standard
Board thickness0.1 to 6.0 mm
Surface finishesImmersion silver, ENIG, ENEPIG, immersion tin, OSP, hard gold
Special processesCavities, copper coin, metal backing, back-drilling, edge plating, via-in-pad
Test and inspectionFlying probe, TDR, AOI, X-ray, microsection
Build standardsIPC-6012 and IPC-6018, Class 2 or Class 3

How an order runs

  1. Send your files

    Gerber or ODB++, drill file, stackup and target impedances. A PDF drawing helps.

  2. DFM and stackup review

    An RF engineer checks etch compensation, stackup, material stock and tolerances, and sends a report with the quote.

  3. Fabrication

    Lamination, drilling, PTFE hole treatment, plating and imaging with per-panel etch compensation.

  4. Test

    Electrical test on every board, TDR on impedance coupons, and microsections per lot.

  5. Ship

    Vacuum packed with test report, certificate of conformance and laminate lot certificates.

Every lot ships with electrical test data, TDR coupon results, microsection images and laminate certificates.

  • ISO 9001:2015
  • UL 796
  • RoHS and REACH
  • IPC-6018 Class 3 on request

Have a stackup ready? Get it reviewed.

Send Gerbers or ODB++ with your stackup and impedance targets. An RF engineer replies with pricing, material availability and a DFM report.

  1. Upload Gerber or ODB++
  2. Engineer DFM review
  3. Price and report in one day
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